NTT DOCOMO, NEC, Panasonic Mobile Communications, and Fujitsu have jointly developed the software and hardware intellectual property for a single large-scale integration (LSI) chip.
The chip will enable small, energy-efficient modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards.
Performance evaluation of the LSI engineering sample chip as well as all testing required to confirm interconnectivity to the mobile networks of major vendors have been completed.
This means that modems in future mobile devices will require just one chip, rather than two chips required in many conventional cases, in order to operate on multiple mobile standards.